Google switches to custom TSMC node for upcoming Tensor G6

Google is moving production of its upcoming Tensor G6 chip to TSMC, bringing a new 7-core CPU layout and MediaTek modem to future Pixel phones.

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Custom 2nm manufacturing at TSMC

Google is shifting fabrication away from Samsung Foundry for its upcoming Tensor G6 chip, contracting TSMC to build the silicon on its 2nm node. Past Tensor chips suffered from thermal throttling and battery drain when running under sustained heavy loads. This manufacturing switch gives Google tighter power control and better thermal ceilings.

The CPU uses an atypical 7-core setup based on ARM's Armv9.3-A architecture. It includes one ARM C1-Ultra core running at 4.11GHz, four C1-Pro cores at 3.38GHz, and two C1-Pro cores clocked down to 2.65GHz for baseline efficiency. Internal benchmarks point to a 25 percent bump in web browsing responsiveness and 20 percent better power efficiency.

MediaTek modem and custom TPU

Google is also dropping the Samsung Exynos modem in favor of a customized MediaTek 5G modem. The change addresses persistent signal drop issues that plagued earlier Pixel devices in low-reception areas.

• The custom Tensor Processing Unit runs on-device Gemini Nano models with minimal battery drain.
• PowerVR CXTP graphics replace older Mali units to handle user interface rendering and casual 3D tasks.
• Hardware-based image processing supports multi-exposure computational photography directly on the sensor stream.

The Tensor G6 will arrive exclusively inside Google's flagship Pixel lineup next year. Pricing for the hardware remains unannounced, but the higher fabrication costs at TSMC could push retail handset prices up by $50 to $100.